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**Analysis of the Electroplating Process of the Anti-Friction Layer of Sliding Bearings**
Home > Bearing Knowledge > Analysis of Electroplating Process of Anti-Friction Layer of Sliding Bearing
Source: Bearing Network | Time: February 9, 2013
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The electroplating process of the anti-friction layer in sliding bearings is a critical step that significantly affects the performance and durability of the bearing. When the anti-friction coating is directly electroplated onto the base metal, tin tends to diffuse into the substrate over time. After prolonged operation, the tin content in the coating may drop below 6% (by weight), while the copper-based alloy remains as an aluminum-based alloy. Both materials contain a certain amount of copper, which can lead to the formation of brittle intermetallic compounds such as Cu₃Sn when tin interacts with copper.
This reaction degrades the mechanical properties of the coating and disrupts the structural integrity of the bearing, ultimately reducing its overall performance. To prevent this issue, a common solution is to deposit a thin layer of nickel or a nickel-based alloy between the base material and the anti-friction layer. This barrier layer helps control the diffusion of tin into the base metal and ensures a more stable composition of the anti-friction coating during operation.
In addition to the barrier layer, some methods involve applying a protective layer of tin or lead-tin alloy. These layers not only provide corrosion resistance but also help maintain a consistent distribution of tin within the anti-friction layer throughout the bearing's service life. Since these protective layers are relatively soft and free from copper, they allow for excellent break-in performance at the start of operation, ensuring smooth and efficient running conditions.
The development of electroplating techniques for friction-reducing layers has a long history. In 1920, Groov (J. Grooff) filed the first patent for electroplating lead-tin alloys, which was later used in applications such as torpedo gas cylinders. By the early 1940s, the technique was applied to bearing pads. In 1952, Schults proposed a patent for electroplating lead-tin-copper ternary alloys on aluminum and aluminum-silicon substrates. Schoefe later introduced the use of lead-tin-copper alloys for bushings.
Further advancements were made in the 1970s and 1980s. In 1976, Jong Sang Kim, Su Il Pyun, and Hyo Geun Lee published a paper titled "Pore-Orientation and Microscopic Tracing of Lead-Silver-Copper Coatings." In 1980, Beebe introduced a process for electroplating copper-containing ternary alloys with 2–3% copper and 9–12% tin, with a coating thickness of 15 μm. In 1982, Waterman and others proposed a method for controlling copper ions (Cu²âº) in ternary alloy plating solutions.
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